Kulicke & Soffa Introduces New Offerings at SEMICON China 2018

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SINGAPORE–(BUSINESS WIRE)–Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”,
“K&S” or the “Company”) will be showcasing newly launched equipment and
marketing leading packaging solutions during SEMICON China 2018 trade
show at Shanghai New International Expo Center (SNIEC) in Shanghai from
March 14 to 16.

The latest range of solutions, RAPID™ Pro GEN-S (Smart) Series
ball bonder and OptoLux™ ball bonder for LED will be featured at
the SEMICON China trade show. The RAPID™ Pro introduces advanced process
capabilities with real-time monitoring and diagnostics to ensure highest
yield, while the high speed OptoLux™ is set to revolutionize the wire
bonding in LED market focusing on ease-of-use with recommended start-up
parameters to facilitate process optimization. In addition to these, the
Company will be demonstrating capabilities of its high performance APAMA™
DA
die attach, latest multifunctional iFlex T2 equipment,
together with its broad range of aftermarket products and services
comprise of spares, consumables, software, repair and refurbishment
services.

Hoang Huy Hoang, Kulicke & Soffa’s Senior Vice President of Global Sales
& Aftermarket Products and Services Business Unit, said, “The
semiconductor market continues to evolve rapidly with increasing demand
of highly complex and more integrated packaging technologies. Apart from
providing our customers with innovative and high-performance equipment
to address these challenges, we want to extend our support through a
full range of aftermarket solutions to improve uptime, enhance asset
utilization and augment fleet and process management.”

Customers can see the full assembly of solutions at the SEMICON China
trade show in Shanghai, China, Hall N3, Booth #3409.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor
packaging and electronic assembly solutions supporting the global
automotive, consumer, communications, computing and industrial segments.
As a pioneer in the semiconductor space, K&S has provided customers with
market leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, electronics assembly,
wedge bonding and a broader range of expendable tools to its core
offerings. Combined with its extensive expertise in process technology
and focus on development, K&S is well positioned to help customers meet
the challenges of packaging and assembling the next-generation of
electronic devices. (www.kns.com)

Contacts

Kulicke & Soffa Industries, Inc.
Marilyn Sim
Public
Relations
P: +65-6880-9309
F: +65-6880-9580
msim@kns.com
or
Joseph
Elgindy
Investor Relations & Strategic Initiatives
P:
+1-215-784-7500
F: +1-215-784-6180
investor@kns.com

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